Radio modulebased TI CC1311P3 transceiver chip.

N531DS CC1311P3 transceiver module designed for 169M, 433M, 868MHzand 915MHz band. AT command and UART support.

N531DSintegrated TI CC1311P3 transceiver chip, suitable for 169M, 433M, 868MHz,915MHz band. N531DS module has the characteristics of low cost, low powerconsumption and small size. Module is mainly for IoT, intelligent home,wireless meter reading, scientific research and medical treatment, and mediumand long-distance wireless communication equipment. N531DS leadsall pins out of CC1311P3 transceiver chip for secondary development.

N531DS(CC1311P3) is suitable for free frequency band in EU and USA.

CC1311P3 Description

The SimpleLink™CC1311P3 device is amultiprotocol Sub-1 GHz wireless microcontroller (MCU) supporting IEEE802.15.4g, IPv6-enabled smart objects (6LoWPAN), MIOTY, Wi-SUN, proprietarysystems, including the TI 15.4-Stack (Sub-1 GHz). The device is optimized forlow-power wireless communication and advanced sensing in building security systems, HVAC, smart meters, medical, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets. Thehighlighted features of this device include:

• Flexible Sub-1 GHz radio supporting industry     standard frequency bands (315 MHz, 433 MHz, 868 MHz, 900 MHz, and more) to     meet the industrial needs.

• Wide flexibility of protocol stack support in     the SimpleLink™ CC13x2 and CC26x2 Software Development Kit (SDK) including     complete SimpleLink™     15.4-Stack (Sub-1 GHz) solution.

• Maximum transmit power of +14 dBm at Sub-1 GHz     with 24.9 mA current consumption.

• Longer battery life wireless applications with     low standby current of 0.85 µA and full RAM retention.

• Industrial temperature ready with lowest standby     current of 11 µA at 105°C.

• Advanced sensing with a programmable, autonomous     ultra-low power Sensor Controller CPU with fast     wake-up capability. As an example, the sensor controller is capable of     1-Hz ADC sampling at 1 µA system current.

• Low SER (Soft Error Rate) FIT     (Failure-in-time) for long operation lifetime with no disruption for industrial     markets with always-on SRAM parity against corruption due to potential     radiation events.

• Dedicated software controlled radio controller     (Arm® Cortex®-M0) providing flexible low-power RF transceiver     capability to support multiple physical layers and RF standards.

• Excellent radio sensitivity (-121 dBm) and     robustness (selectivity and blocking) performance for SimpleLink™ long-range mode.

The CC1311P3 device is part of theSimpleLink™MCU platform, which consists ofWi-Fi, Bluetooth Low Energy,Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common,easy-to-use development environment with a single core software development kit(SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse whenyour design requirements change. For more information, visit SimpleLink™ MCU platform.

ISM Frequency supported by N531DS module

169Mband: 169 MHz to 170 MHz (China, EU)

433Mband: 433 MHz to 435 MHz (China, EU)

470Mband: 470 MHz to 510 MHz (China)

770Mband: 770 MHz to 780 MHz (China)

868Mband: 868 MHz to 870MHz (China, EU, USA)

                      888 MHz to 889 MHz (Australia)

915Mband: 902 MHz to 928MHz (USA)

N531DS Parameters

‍DownloadN531DS datasheet

Orderinginformation

N531DS-433M   CC1311P3 chip     14dBm, 410M-510MHz

N531DS-868M   CC1311P3 chip     14dBm, 860M-960MHz

Othermodules

N533FS-433M    CC1312R+PA              24dbm,410Mhz-510Mhz

N533FS-868M    CC1312R+PA             24dbm, 860Mhz-960Mhz

N623PA-868M    CC1312R+CC1190     27dbm, 860Mhz-880Mhz

N623PA-915M    CC1312R+CC1190     27dbm, 910Mhz-930Mhz

N533ES-433M    CC1312R+PA             30dbm,410Mhz-440Mhz

N533ES-490M    CC1312R+PA             30dbm,470Mhz-510Mhz

N533ES-868M    CC1312R+PA            30dbm, 860Mhz-880Mhz

N533ES-915M    CC1312R+PA            30dbm, 910Mhz-930Mhz

Test method of N531DS module

Take the supporting base plate of Heyan technology as an example:

The bottom board of N531DS is T532AP, which integrates USB to serial chip,led, button, burning port and module card port. As shown in the figure:

N531DS secondary development method:

The CC1311P3 module is stuck on the backplane as shown in the figure, andthe IPEX is connected with the antenna. The burning port is connected withxds110 according to the silk screen printing, and then online simulation can becarried out to test the performance of the module.

Module Programming

The schematic diagram of the module base plate can be obtained from ourofficial website.

Please contact us for specific programming information or download it fromTI official website www.ti.com.